Consultez les proceedings de la Conference COMSOL 2024
The phase-field method is a powerful computational approach in modeling microstructure evolution in materials at the mesoscopic scale. The microstructure evolution of thermally induced structural transformation in shape memory alloys (SMAs) has been widely studied by phase-field ... En savoir plus
随着电子器件尺寸持续缩小接近物理极限，摩尔定律正面临巨大挑战，半导体制造业开始过渡到“超越摩尔”的三维集成时代。铜硅通孔是实现三维集成的关键技术之一，该技术通过铜硅通孔将多个芯片堆叠互连。然而，实际使用铜硅通孔互连芯片存在着可靠性问题，例如铜硅通孔的凸起。这个现象是由于铜与硅之间热膨胀系数的差异较大，因此在器件服役过程中会产生显著的热应力，造成铜硅通孔的凸起，严重地影响到器件的功能和完整性。为研究铜硅通孔凸起的机理，本文采用相场晶体法从原子尺度模拟重现硅通孔的凸起过程。在COMSOL Multiphysics基本模块中 ... En savoir plus
由于REBCO涂层高温超复合导带的一些特殊结构特征，带材中三层宽厚比极大的薄层（银层，超导层和缓冲层），在3D有限元分析中网格剖分数目大而且单元奇异性增大，进而导致计算量极大。为了有效解决由于REBCO超导带中各层在3D有限元模型网格划分和计算上带来的困难，并且尽可能精确构建带材真实结构。本文建立了高效的REBCO涂层超导带材的3D/2D混合维度有限元模型，即宽厚比极大的薄层采用2D薄膜单元其余采用3D实体单元；进一步，基于内聚力本构关系建立了REBCO涂层复合超导带材层间剥离失效和破坏问题的3D/2D混合维度有限元数值模型 ... En savoir plus
The emerging technologies related to AI and Quantum Computing are shifting the nano-bio-info paradigm, reconsidering the presently assumed bioenergetic processes of the living cells. Thus, a key process as ATPase can be considered through a model governed by quantum field theory (QFT) ... En savoir plus
Fiber-reinforced composite materials are widely used for building lightweight parts in several application fields like aviation or naval industry. Here the longitudinal fibers, which take the main mechanical loads of the component, are embedded in a shape giving resinous matrix. The ... En savoir plus
According to a report conducted by the World Health Organization (WHO), more than 466 million people suffer from hearing loss. Conventional hearing aids are sufficient for most patients, being constantly further developed and optimized - connecting the service of the hearing aid to the ... En savoir plus
Digitization is affecting more and more industrial sectors. In the field of orthopedic technology, new technologies such as 3D scan and 3D printing are used in production. This opens up new fields of application for the simulation. The example of a scoliosis corset shows how the new ... En savoir plus
Non-contacting guided wave tomography based on laser ultrasonic waves can be used to inspect structures that are inaccessible to traditional ultrasound methods. Such structures could be, chemically or physically hard to reach, e.g. hot metal structures, metal implants inside tissue or ... En savoir plus
Through Silicon Via (TSV) is one of the key technologies for 3D integration. It is a vertical electrical connection that passes through a silicon wafer and establishes the signal transmission between the front and the backside of the device. In the so-called “TSV last” integration ... En savoir plus
Introduction With the vast development in the aerospace industry it is inevitable that currently used materials such as Nickel based super alloys will soon reach its peak performance. Hence developing alternative materials with similar properties that could be enhanced further is ... En savoir plus