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Ici vous trouverez les présentations issues des Conférences COMSOL à travers le monde. Réalisées par des utilisateurs de COMSOL Multiphysics, ces présentations explorent tous les domaines actuels d'innovation. Les applications couvrent pratiquement tous les secteurs industriels et impliquent des phénomènes électriques, mécaniques, fluidiques et chimiques. Utilisez la recherche rapide pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt.

Consultez les proceedings de la Conference COMSOL 2020

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Boston 2024

Munich 2023

Local Conduction Heat Transfer in U-pipe Borehole Heat Exchangers

J. Acuna[1] and B. Palm[1]

[1]Department of Energy Technology, KTH, Stockholm, Sweden

The most common way to exchange heat with the bedrock in Ground Source Heat Pump (GSHP) applications is circulating a fluid through a U-formed closed loop in vertical boreholes drilled several tenths of meters into the ground. This study presents and compares the results of eight cross ... En savoir plus

Detection of Magnetic Particles by Magnetoresistive Sensors

A. Weddemann[1], A. Auge[1], F. Wittbracht[1], C. Albon[1], and A. Hütten[1]
[1]Department of Physics, Thin Films and Physics of Nanostructures, Bielefeld University, Bielefeld, Germany

In this work, we demonstrate the implementation of the micromagnetic equations for the description of ferromagnetic thin films in COMSOL Multiphysics®. We apply our model to magnetoresistive sensors consisting of several soft ferromagnetic layers and their response to magnetic particles. ... En savoir plus

Model of Heat and Mass Transfer with Moving Boundary During Roasting of Meat in Convection-Oven

A.H. Feyissa[1], J. Adler-Nissen[1], and K.V. Gernaey[2]
[1]Food Production Engineering, National Food Institute, Technical University of Denmark, Kgs. Lyngby, Denmark
[2]Department of Chemical and Biochemical Engineering, Technical University of Denmark, Kgs. Lyngby, Denmark

A 2D mathematical model of coupled heat and mass transfer describing oven roasting of meat was formulated from first principles. The current formulation of model equations incorporates the effect of shrinkage phenomena and water holding capacity. The model equations are based on ... En savoir plus

3D Electro-Thermal Study for Reliability of Automotive Power Vertical MOSFET Using COMSOL Multiphysics^®

T. Azoui[1], S. Verde[1][2], J.B. Sauveplane[1], and P. Tounsi[1]
[1]LAAS-CNRS, Toulouse, France
[2]Department of Electronics and Telecommunications Engineering, University of Naples Federico II, Naples, Italy

In this paper 3D electro-thermal FE Model using COMSOL Multiphysics® software of power vertical MOSFET used in the automotive industry is presented. This model is used to analyze the effects of bonding wire lift off defect and to study the influence of metallization thickness and ... En savoir plus

Thermal Simulation and Package Investigation of Wireless Gas Sensors

A. Paoli[1], L. Seminara[2], D.D. Caviglia[1], A. Garibbo[2], and M. Valle[1]

[1]Department of Biophysical and Electronic Engineering, University of Genova, Genova, Italy
[2]SELEX Communications S.p.A., Genova, Italy

Gas sensor arrays based on metal oxides operating at high temperature are commonly used in many application fields. They can operate on different principles and each sensor may show very different responses to the individual gases in the environment. Data coming from the array can be ... En savoir plus

Chip Drop After Silver Sintering Process

M.H. Poech[1], M. Weiß[1], and K. Gruber[1]

[1]Fraunhofer Institute for Silicon Technology, Itzehoe, Germany

Since a couple of years, sintering becomes more and more important for power electronics. To press a semiconductor under high temperature in silver paste on a substrate promises benefits for durability. Tests with semiconductors of different thickness expose some problems. After the cool ... En savoir plus

Multi-Scale Modelling of Catalytic Microreactors

B. Hari[1] and C. Theodoropoulos[1]
[1]The University of Manchester, School of Chemical Engineering and Analytical Science, Manchester, UK

Microreactors are important alternative to conventional reactors in chemistry, chemical, pharmaceutical and semiconductor industries due to their operation characteristics such as increased mass and heat transfer, uniform flow, safety, high throughput through array configurations, ... En savoir plus

Safe Storage Parameters During CO2 Injection Using Coupled Reservoir ...

Safe Storage Parameters During CO₂ Injection Using Coupled Reservoir-Geomechanical Analysis

T.I. Bjørnarå[1], E. Aker[1], and E. Skurtveit[1]
[1]NGI, Oslo, Norway

Safe short term storage of CO2 depends mainly on structural and solubility trapping. On longer term, mineral trapping is also contributing to the trapping of CO2. To be able to investigate the importance of these different storage mechanisms, a finite element model for simulation of CO2 ... En savoir plus

Simulating the Influence of the Nozzle Diameter on the Shape of Micro Geometries Generated with Jet Electrochemical Machining

A. Schubert[1][2], M. Hackert[1], and G. Meichsner[2]

[1]Chair Micromanufacturing Technology, Faculty of Mechanical Engineering, Chemnitz University of Technology, Chemnitz, Germany
[2]Fraunhofer Institute for Machine Tools and Forming Technology, Chemnitz, Germany

Jet Electrochemical Machining (Jet-ECM) is an unconventional procedure for micromachining. Based on localized anodic dissolution three-dimensional geometries and microstructured surfaces can be manufactured using Jet-ECM. COMSOL Multiphysics is used at Chemnitz UT to simulate the ... En savoir plus

Study of Artificial Molecular Engines Action Through COMSOL Multiphysics^® Program

L. Moro[1], F. Lugli[1], and F. Zerbetto[1]

[1]Department of Chemistry “G. Ciamician”, Università di Bologna, Bologna, Italy

Rotaxanes are a class of molecules recently developed in laboratory that have been heralded as possible molecular motors. The motor is constituted by a linear molecule (thread) and a ring-shaped molecule (macrocycle), which is free to move along the thread, switching between two, or ... En savoir plus

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