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3D Electro-Thermal Study for Reliability of Automotive Power Vertical MOSFET Using COMSOL Multiphysics®

T. Azoui[1], S. Verde[1][2], J.B. Sauveplane[1], and P. Tounsi[1]
[1]LAAS-CNRS, Toulouse, France
[2]Department of Electronics and Telecommunications Engineering, University of Naples Federico II, Naples, Italy
Publié en 2009

In this paper 3D electro-thermal FE Model using COMSOL Multiphysics® software of power vertical MOSFET used in the automotive industry is presented. This model is used to analyze the effects of bonding wire lift off defect and to study the influence of metallization thickness and number of bonding wires on the electrical and thermal behavior of the power device. The maximum temperature enables the evaluation of the reliability of the power component. Such modeling is useful for optimization of structure design to guarantee a longer lifespan.

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