Conformément à notre Politique de qualité, COMSOL maintient une bibliothèque de centaines d'exemples de modèles documentés qui sont régulièrement testés avec la dernière version du logiciel COMSOL Multiphysics®, notamment des benchmarks de référence en provenance de l'ASME et de NAFEMS, ainsi que des problèmes TEAM.
Notre suite de tests de vérification et de validation (V&V) fournit des solutions précises qui sont comparées aux résultats analytiques et aux données de référence établies. Les modèles documentés ci-dessous font partie des bibliothèques d'applications intégrées du logiciel COMSOL Multiphysics®. Ils comprennent des valeurs de référence et des sources documentaires pour un large éventail de benchmarks, ainsi que des instructions étape par étape pour reproduire les résultats attendus dans votre propre environnement de travail. Vous pouvez utiliser ces modèles non seulement pour documenter vos efforts en matière d'assurance qualité logicielle (SQA) et de vérification de code numérique (NVC), mais aussi dans le cadre d'un programme de formation interne.
In this example, the Bergstrom–Boyce material model is used to capture the nonequilibrium behavior of carbon-black-filled chloroprene rubber under a strain history that alternates compression with relaxation. Results are verified against experimental and numerical results taken from ... En savoir plus
The small strain overlay material model captures the effect of high stiffness at low strain as well as the hysteresis under cyclic loading, which is a common effect for most soils. The formulation allows stiffness degradation with an increase in shear strain, and the full recovery of ... En savoir plus
In this example, the Bergstrom–Bischoff material model is used to model the temperature and strain dependent behavior of High Density Polyethylene (HDPE) used, for example, to make liners for damaged pipes in oil and gas applications, or to make type IV hydrogen storage vessels for fuel ... En savoir plus
In this example, a benchmark problem in dynamic fracture of brittle materials is analyzed using the AT1 phase-field damage model. An instantaneous tensile load is applied to a planar tension specimen with a pre-existing crack. Initially, the crack propagates perpendicular to the loading ... En savoir plus
Ultrahigh Molecular Weight (UHMW) Polyethylene is a material commonly employed in knee and hip joint replacements. The “small punch test” is designed to assess mechanical properties using very small samples, such that because of their size they can directly be explanted. This example ... En savoir plus
Unwanted arcing can have serious adverse effects on electrical and electronic equipment and systems. To improve the understanding and prediction of arc dynamics, it is crucial to conduct multiphysics simulations of transient arc processes. This model features a 3D simulation of transient ... En savoir plus
The installation verification application can be used to help verify that your COMSOL Multiphysics® or COMSOL Server™ installation works as expected on your hardware platforms and operating systems. The app automatically loads and runs a suite of test models and compares the results with ... En savoir plus
This model simulates a negative dielectric barrier discharge under a point-to-plate electrode configuration. Two solid dielectric layers are inserted into the air gap. A negative voltage of 2.5 kV is applied to the cathode electrode, initiating a corona streamer that propagates and ... En savoir plus
This example uses the Electric Currents in Layered Shells interface and the Layered Shell interface to model a piezoresistive pressure sensor. The tutorial considers the design of the MPX100 series pressure sensors originally manufactured by Motorola Inc. Although the sensor is no ... En savoir plus
This model simulates the propagation of a double-headed streamer in nitrogen at atmospheric pressure. Initially, electron-positive ion clusters were introduced between two parallel electrodes, subjecting the gas to a strong background electric field of 52 kV/cm. Subsequently, both the ... En savoir plus