COMSOL Conference 2024 Proceedings
Collection of Papers, Posters, and Slideshows Accepted by the Program Committee
At the COMSOL Conference 2024, engineers, researchers, and scientists from around the globe showcased their use of modeling and simulation across all major industries and in academia. Use the Quick Search tool to find a specific presentation or filter by topic or event location.
ISBN: 978-1-7364524-2-4
Mine hoists are significant capital investments, so their efficient, safe, and reliable operation are of vital importance to mining companies. ABB delivers numerous drum hoisting systems to underground mines in China, South Africa, as well as to Poland. ABB mine hoists are one of the ... En savoir plus
As part of its research, the Group of Electrical Engineering-Paris (GeePs) uses COMSOL Multiphysics software for applications such as material modelling in Electrical Engineering, electromagnetic compatibility and Eddy current non-destructive testing (EC-NDT). EC-NDT is an easy-to-use ... En savoir plus
In recent years, the development of artificial intelligence has enabled some disruptive innovations by changing the way research is conducted. More specifically, in computer science, a new way of developing algorithms has emerged, based on machine learning techniques. The core idea is to ... En savoir plus
Surrogate Models are used to predict the power transmission of an Electric Road System (ERS). The ERS consists of a transmitter coil integrated into the road and a receiver coil underneath an electric vehicle. Accordingly, this technique enables the dynamic charging of the vehicle via ... En savoir plus
The storage of CO2 in the sub-surface is seen as a technology that can contribute to the generally accepted goal of a de-carbonized society. As real field experiments are hardly feasible, many current studies utilize the capabilities of numerical modelling. Concerning the practical ... En savoir plus
The aim of this study is to predict deformed shapes of electronic packages after molding process through finite elements analysis (FEA). Warpage phenomenon is studied on different types of manufacts: a simple dual beam sample composed of copper and molding compound, a single package ... En savoir plus
Thermoelectric sensors, which are capable to convert temperature gradients into electrical signals, hold promise for use in wearable body-temperature monitors and self-powered electronic devices. However, traditional flexible thermoelectric devices constructed with organic materials have ... En savoir plus
消声器结构简单、维护成本低，已经成为工业噪声治理的主要手段之一。由于现代工业噪声水平高、低频大波长、环境复杂等特性，对消声器消声性能提出更高需求的同时，对其结构、材料及设计理论提出更高要求。传统消声器中多孔材料内部粘弹-热属性受流相中空气本征态限制，无法在有限空间内实现高效低频消声，（声学）超构材料的出现为其提供新思路与方法。 鉴于此，本文主要开展（超构）消声器设计理论与优化方法研究。首先，依据测量结果，提取噪声信号的频谱特性，结合数据库及其挖掘技术，采用人工智能算法，设计超构材料并选取多孔材料；其次，根据阻抗匹配技术，迭代材料结构与尺寸参数，优化其消声特性；最后 ... En savoir plus
随着大规模集成电路的发展，大尺寸电子级直拉单晶硅的需求与日俱增，而硅片尺寸增大的同时，氧相关缺陷带来的问题更加凸显。硅片中的氧相关缺陷有利有弊，因此直拉法生长单晶硅中的氧含量控制十分重要。本文基于COMSOL Multiphysics对12英寸电子级直拉单晶硅生长过程进行数值模拟分析，研究直拉单晶硅在不同凝固阶段下，晶体与熔体中氧浓度的变化，并计算出不同凝固阶段下氧在晶体和熔体两相中的浓度分布。通过考虑水冷屏，增加固液界面处的温度梯度，进而根据Voronkov理论计算出晶体中微缺陷区与“完美晶体区”。基于该模型，比较不同直径的坩埚对生长12寸直拉单晶硅的影响。结果表明 ... En savoir plus
SiC半导体材料的禁带宽度、热导率、电场击穿强度、饱和电子漂移率等物理特性远优于Si，这使得它更适合于制造高功率电力电子器件，SiC器件的性能与SiC衬底的质量密切相关。SiC晶体生长过程存在许多亟需解决的技术难题，如坩埚的多孔性导致晶体生长过程中少量气体溢出坩埚外，造成原料浪费及气体物质与坩埚反应腐蚀坩埚，甚至破坏晶体生长的稳定性。因此，我们采用有限元软件COMSOL对物理气相传输法（PVT）生长SiC晶体的物理过程进行模拟分析, 初步建立了计算SiC晶体生长过程的热场—流场—组分输运耦合模型，研究了坩埚多孔性和坩埚壁腐蚀效应对温度场、Si, SiC2, ... En savoir plus