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Residual Stresses in a Panel Manufactured Using EBF3 Process

J. Gaillard[1], D. Locatelli[2], S. Mulani[3], and R. Kapania[3]
[1]Microelectronics and Micromechanics Department, Engineering school of ENSICAEN (Ecole National Superieure d'Ingénieurs de Caen), Caen, France
[2] Engineering Science and Mechanics Department, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA
[3] Aerospace and Ocean Engineering Department, Virginia Polytechnic Institute and State University, Blacksburg, Virginia, USA
Publié en 2008

The residual stresses developed in a stiffened panel manufactured using Electron Beam Freeform Fabrication (EBF3) process were studied. EBF3 process is a layer additive process that can be used to build near-net shaped parts directly using computer controlled techniques, which can be used for aerospace structures.

A COMSOL model was created to simulate the residual stresses using a thermo-mechanical analysis, with the Goldak’s semi ellipsoidal moving heat source. The obtained results indicate that residual stresses are under the yield strength of the material used.

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