Articles techniques et présentations

This paper gives an overview of modelling microsensors on geometry and system level. The focus will be on the generation of the multiphysics reduced order system model and the coupling with package and ASIC models. The method is based on modal superposition. This means all the details of the sensor can be considered in a finite element model. The mechanical mode shapes of this model form the basis of the reduced order model that can be coupled with other physics or models. Other physics can be fluidic damping or electrostatics for the drive and sense electrodes. Other models can be a package model to account for offset, a shift in sensitivity with temperature or the excitation of parasitic modes due to vibration. A possible application of the methodology is a gyro design which is more robust to vibrations.