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Multiphysics Simulation of Conjugated Heat Transfer and Electrostatic Field on Application of Electrostatic Chucks (ESCs) Using 3D-2D Model Coupling

K. Hsu[1], C. Li[1], J. Yang[1], J. Chen[1], J. Chang[1]
[1]Institute of Applied Mechanics, National Taiwan University, Taipei, Taiwan
Publié en 2014

There has been considerable interest in the electrostatic chucks (ESCs) in recent years. Wafer cooling by means of gas at the backside of wafers plays an important role in electrostatic chucks and it uses an electrostatic potential to secure the wafer. In this study, the correlation of the electric voltage and electrostatic force distribution are considered to the ability of heat conductance. For this purpose, multiphysics simulation has been carried out to study the influence of electrostatic on temperature distribution of a wafer. The resulting temperature distribution on a wafer held by a ceramic body of the electrostatic chuck is investigated and conduct the conjugated heat transfer in 3D and electrostatic force is presented in 2D.

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