Articles techniques et présentations

In this paper, we consider the finite element modeling of multilayer transmission lines for high-speed digital interconnects. Using COMSOL we mainly focused on the modeling of the transmission structures with both cases of symmetric and asymmetric geometries. We specifically designed asymmetric coupled microstrips and four-line symmetric coupled microstrips with a two-layer substrate. We computed the capacitance, inductance, and impedance matrices for four-line symmetric coupled microstrips, and the capacitance matrix for asymmetric coupled microstrips. We also provide the potential distribution spectrums of the models.