Articles techniques et présentations

High-power couplers working at 350 MHz for particle accelerator cavities are presently under development in the LEHIPA project at BARC. It is important to analyze RF losses on conducting surfaces and resulting thermal profiles. COMSOL Multiphysics® is used to study these coupled RF-thermal effects and estimate cooling requirements for these couplers. The RF loss on the copper conductors and dielectric loss on the RF window are modeled using the COMSOL RF Module. This loss is used to calculate the thermal profiles and estimate cooling requirements. The RF loss data is coupled to the Heat Transfer Module to carry out parametric studies on temperature profiles for different input power and cooling rates. The results of coupled RF-thermal analysis are reported in this work.