Epoxy Resin Curing Process for Basin-Type Insulators
Application ID: 137951
Basin-type insulators are critical components in Gas-Insulated Metal-Enclosed Switchgear (GIS). During the manufacturing process, the curing of epoxy resin can generate residual stresses that may lead to the formation of cracks in insulators. Over time, these cracks can cause partial discharges, compromising the safe operation of GIS equipment by impairing its electrical insulation performance.
This model simulates the epoxy resin curing process and studies the residual stress in the basin-type insulator. The curing reactions, heat generation, thermal expansion, and curing shrinkage are considered to accurately predict the residual stress.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® et
- Module Design et
- Module Polymer Flow et
- soit le Module MEMS, Module Metal Processing, ou Module Structural Mechanics
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Grille des Spécifications and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.