La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This tutorial model of the Joule heating effect in a busbar demonstrates how to synchronize an assembly between the PTC Creo Parametric™ software and the COMSOL Multiphysics® software, how to modify the geometry from COMSOL Multiphysics®, and how to run a ... En savoir plus
Powder compaction is a popular manufacturing process not only in powder metallurgy, but also in the pharmaceutical industry. The Capped Drucker–Prager model is commonly used for simulating the compaction processes of pharmaceutical powders, where the material properties depend on the ... En savoir plus
This tutorial model simulates a pair of straight conical bevel gears. The gears are modeled as rigid, but one of the gears is fixed while the other is hinged on a rigid bar. The rigid bar is also hinged at a point lying on the axis of the fixed gear. A transient analysis is performed to ... En savoir plus
This tutorial model of the Joule heating effect in a busbar demonstrates how to synchronize an assembly between the Inventor® software and the COMSOL Multiphysics® software, how to modify the geometry from COMSOL Multiphysics®, and how to run a geometric parametric ... En savoir plus
This tutorial simulates the turn-off transient (reverse recovery) of a simple PIN diode with an inductive load, loosely based on the book "Fundamentals of Power Semiconductor Devices" by B. J. Baliga (p. 256, 2008 edition). Unlike the book, which assumes an initial constant current ramp ... En savoir plus
This model extracts spice parameters for a silicon p-n junction diode. The spice parameters are used to create a lumped-element equivalent circuit model of a half-wave rectifier that is compared to a full device level simulation. In this example, a device model is made by connecting a 2D ... En savoir plus
This app demonstrates the following: Multiple components (1D and 3D) in a single app Using the same choice list in the app as in the model using Data Access functionality Output numerical results for a specific time step using a combo box The app combines the Ray Optics Module and ... En savoir plus
This model demonstrates how to couple the Semiconductor interface to the Heat Transfer in Solids interface. A thermal analysis is performed on the existing bipolar transistor model in the case when the device is operated in the active-forward configuration. The Semiconductor interface ... En savoir plus
Interfacial failure or delamination in a composite material can be simulated with a cohesive zone model (CZM). A key ingredient of a cohesive zone model is a traction-separation law that describes the softening in the cohesive zone near the delamination tip. This example shows the ... En savoir plus
This tutorial drives a capacitively coupled plasma with an L-type matching network at high and low powers. At low power, where the harmonics in the current are low, prefect matching is obtained at the chosen power value. Sweeps over power, frequency, and pressure are performed and their ... En savoir plus