La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
HowTo: Using the EC External I-Terminal The External Couplings in the CIR interface has two flavors that can be used. External I vs. U and External I-terminal. The former has two nodes (it represents a differential external voltage measurement) and when coupling to an EC Terminal ... En savoir plus
This example considers the thermal cracking of acetone, which is a key step in the production of acetic anhydride. The gas phase reaction takes place under nonisothermal conditions in a plug-flow reactor. As the cracking chemistry is endothermic, control over the temperature in the ... En savoir plus
A time-varying current induces a time-varying magnetic field. The magnetic field induces currents in neighboring conductors. The induced currents are called eddy currents. In this model, the phenomenon is illustrated by a time-harmonic field simulation as well as a transient analysis, ... En savoir plus
This application uses the Chemical Reaction Engineering Module to study an elementary, exothermic, irreversible reaction in a tubular reactor (liquid phase, laminar flow regime). To keep its temperature down, the reactor uses a cooling jacket with a constant coolant temperature. The ... En savoir plus
The four-point bending test is a conventional test method used to test the mechanical properties of materials subjected to bending. It is a reliability test used for semiconductor packaging and assembly. This model demonstrates the stress analysis of an IGBT module subjected to a four ... En savoir plus
The model utilizes a dedicated mesh refinement study, Frequency Domain RF Adaptive Mesh, which dynamically refines the mesh in the region of interest. For the Application Library model Microstrip Patch Antenna, it increases the mesh resolution around areas with high field variations. The ... En savoir plus
A thin-walled container made of rolled steel is subjected to an internal overpressure. As an effect of the manufacturing method, the out-of- plane direction has a higher yield stress than the other two directions. Hill’s orthotropic plasticity is used to model the difference in yield ... En savoir plus
This example applies the Electrophoretic Transport and Laminar Flow interfaces to model isoelectric separation in a free-flow electrophoresis device. A stream containing six different ionic species is shown to be divided into pure component streams by means of migrative transport in an ... En savoir plus
This model demonstrates how to vary the inlet temperature in a superheated steam drying process so as to minimize the time, while constraining both the energy consumption and the final moisture content. En savoir plus
This tutorial shows how to use the Radiative Beam in Absorbing Media interface (Heat Transfer Module) to model the attenuation of a laser light going through a sample of silica glass, and the heat source generated by the absorption. En savoir plus
