La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This model evaluates the temperature distribution in 3 buried cables in a situation where the soil surface temperature is known. The temperature profile obtained with a thermal circuit approach for the cables is compared with a FEM approach. The thermal circuit properties are established ... En savoir plus
This app demonstrates the following: Visualization of a periodic structure from a unit cell Resetting some or all input parameters Export the resulting material properties as an MPH-file or an XML-file that can be imported to a COMSOL Multiphysics session Periodic microstructures are ... En savoir plus
Droplet evaporation is ubiquitous in everyday life and is essential in many industrial processes, such as inkjet printing, cleaning/coating of surfaces, and phase change heat transfer. This model demonstrates how to model phase transition by a moving exterior boundary condition using ... En savoir plus
This model studies the heat conduction in a building structure separating two floors from the external environment. Four materials with distinct thermal conductivities k compose the structure. The exterior and interior boundaries are facing environments respectively at 0°C and 20°C. The ... En savoir plus
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... En savoir plus
In this time-dependent model, a silica block of glass, coated with a thin copper layer is subjected to a heat flux. Copper is a highly conductive material, while the silica glass is of poor thermal conductivity, which sets up an highly-varied temperature differential. The model must ... En savoir plus
Commercial heat exchangers often feature a complex design. It is significantly easier to build a design with new CAD parameters than to build designs with novel topologies. This model demonstrate how to optimize the size and position of the tubes in a tube and shell heat exchanger. It is ... En savoir plus
The inductor is a common component in a variety of electrical devices. Its applications include power transformation and measurements, and it can also be used together with capacitors to create oscillators. In small devices with many components, such as in laptops, heat generation can ... En savoir plus
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach, the thin domains are modeled with thermal resistors in the Lumped Thermal System ... En savoir plus
This example is about the modeling of the fiber drawing process. Thermal fiber drawing is a process in which a comparatively thicker structure is heated and drawn into extended lengths of microstructured fiber. This process is done by passing them through the furnace and pulling them ... En savoir plus