La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This model evaluates the temperature distribution in 3 buried cables in a situation where the soil surface temperature is known. The temperature profile obtained with a thermal circuit approach for the cables is compared with a FEM approach. The thermal circuit properties are established ... En savoir plus
An important and interesting phenomenon with supersonic flows are expansion fans, which take place when the flow encounters a convex or expansion corner. The direction of the flow changes smoothly across the fan, while the Mach number increases. This 2D example models an expansion fan ... En savoir plus
This model illustrates the greenhouse effect in a box covered by a plate and exposed to sun radiation over a day. The temperature variation is monitored in two cases: with a plate made of glass, transparent in the solar spectral band and opaque for the ambient solar band with a fully ... En savoir plus
This model studies the heat conduction in a building structure separating two floors from the external environment. Four materials with distinct thermal conductivities k compose the structure. The exterior and interior boundaries are facing environments respectively at 0°C and 20°C. The ... En savoir plus
In this time-dependent model, a silica block of glass, coated with a thin copper layer is subjected to a heat flux. Copper is a highly conductive material, while the silica glass is of poor thermal conductivity, which sets up an highly-varied temperature differential. The model must ... En savoir plus
The flow around the Eppler 387 airfoil is computed with the SST turbulence model both with and without the transition model. The reuslts are compared with experimental values. En savoir plus
Droplet evaporation is ubiquitous in everyday life and is essential in many industrial processes, such as inkjet printing, cleaning/coating of surfaces, and phase change heat transfer. This model demonstrates how to model phase transition by a moving exterior boundary condition using ... En savoir plus
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... En savoir plus
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... En savoir plus
A 3D model of an acoustic trap in a glass capillary with a bias flow through the capillary. The acoustics is actuated by an oscillating electric potential across a piezoelectric transducer, inducing mechanical vibrations in the solid, and an acoustic pressure field in the fluid. The heat ... En savoir plus