Squeeze-Film Damping of Perforated Plates
Application ID: 60071
This benchmark model compares the damping coefficients of perforated plates from computation results versus experimental data. The simulation includes 18 different geometric configurations. It uses the Bao's perforation model, which is built-in in the Thin Film Flow physics interface. Two limiting cases are also simulated: no perforation and zero relative pressure at the perforations.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® et
- soit le Module CFD, ou Module MEMS
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Grille des Spécifications and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.