Chlorine Discharge Global Model
Application ID: 47611
Plasma discharges containing chlorine are commonly used to etch semiconductors and metals in microelectronics fabrication.
This tutorial model studies chlorine plasma discharges using a global (volume-averaged) diffusion model. Global diffusion models can run simulations in a fraction of the time it would take for space-dependent models. This makes them a good choice to study large reaction sets and extended parameter regions.
The Chlorine Discharge model explores absorbed powers from 50 to 600 W, working with pressures from 1 to 100 mTorr. Model results of several relevant quantities such as electron density, electron temperature, and atomic chlorine density are in good agreement with measurements performed in inductively coupled plasma reactors, found in the literature.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Grille des Spécifications and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.