Heating Circuit — Layered Shell Version
Application ID: 87231
Small heating circuits find use in many applications. For example, in manufacturing processes, they heat up reactive fluids. The device in this tutorial consists of an electrically resistive layer deposited on a glass plate. The layer results in Joule heating when a voltage is applied to the circuit, which results in a structural deformation. The layer’s properties determine the amount of heat produced.
This multiphysics example simulates the electrical heat generation, heat transfer, and mechanical stresses and deformations of a heating circuit device. The model uses the Heat Transfer in Shells interface in combination with the Electric Currents in Layered Shells interface and the Layered Shell interface.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® et
- Module Composite Materials et
- Module Heat Transfer et
- soit le Module AC/DC, ou Module MEMS et
- soit le Module MEMS, ou Module Structural Mechanics
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Grille des Spécifications and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.