Modeling of Microstrip Lines with Vias
Application ID: 74951
There are multiple ways to excite and terminate transmission lines using different types of port and lumped port features. In this example, transverse electromagnetic (TEM) type ports and a via type lumped port are used to simulate two adjacent microstrip lines. One via end is terminated as a metalized via while the other via end is probing an inflow signal. The computed S-parameters show the amount of crosstalk between the lines and the strength of the signal coupled through the cylindrical via.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Grille des Spécifications and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.