Menu

Discussion Forum

New Discussion
Filtrer

Note: This discussion is about an older version of the COMSOL Multiphysics® software. The information provided may be out of date.

Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.

piezoelectric potential of a material structure after thermal deformation

Posted 21 oct. 2013, 08:26 UTC−4 Modeling Tools & Definitions, Parameters, Variables, & Functions, Results & Visualization, Studies & Solvers, Structural Mechanics Version 4.3a 0 Replies

Andre Müller
Send Private Message Flag post as spam

Please login with a confirmed email address before reporting spam

I want to simulate the piezoelectric potential of a material, which is in contact with other non-piezoelectric materials, after a simulated deformation due to a thermal cooldown.

The thermal deformation part isn't the problem. But then I wonder how to set the initial stress of the deformed structure in order to get the piezoelectric potential? Instead of that the piezoelectric device physics gives me an additional deformation due to the calculated piezoelectric potential, which is therefor compensated and everywhere zero. How can I prevent the piezoelectric deformation in order to see the piezoelectric potential?

Any suggestions? To understand my problem in more detail I attached my mph-file. But you still have to do the computation, because of the attachment filesize limitation.

THX

Attachments:

0 Replies Last Post 21 oct. 2013, 08:26 UTC−4
COMSOL Moderator

Hello Andre Müller

Your Discussion has gone 30 days without a reply. If you still need help with COMSOL and have an on-subscription license, please visit our Support Center for help.

If you do not hold an on-subscription license, you may find an answer in another Discussion or in the Knowledge Base.

Note that while COMSOL employees may participate in the discussion forum, COMSOL® software users who are on-subscription should submit their questions via the Support Center for a more comprehensive response from the Technical Support team.

Suggested Content