Discussion Forum

Hello everyone,

I am a very new user to COMSOL Multiphysics and I represent a group of students attempting to use the program to conduct thermal analysis on PCBs in a CubeSat. To conduct the thermal analysis we currently design the boards in SolidWorks using basic geometries for heat producing components (Cubes and such). We then model the components in COMSOL as “heat sources” inputting Q as power dissipated by the component divided by volume. We set the materials of the component as the primary material of the component (Most are silicon). We further simulate convection ht via an inward heat flux on all surfaces inputting h. Are results, though are off and unrealistic in many different simulations. My question, is there an easier way to conduct this analysis? Are we simplifying are model too much that it becomes inaccurate? Are we missing anything?

I understand that this is a broad question, but I would appreciate any help anyone can provide. I can post one of my COMSOL files if it would help to see exactly what we are doing.

Thanks