COMSOL Day: Semiconductor Processing & Packaging
See what is possible with multiphysics modeling
Multiphysics simulation is enabling engineers to keep up with advancements in technology by helping them develop next-generation semiconductor products. At COMSOL Day: Semiconductor Processing and Packaging, a one-day online event exploring the use of physics-based simulation in the semiconductor industry, various topics will be covered, including analysis tools for etching, doping, deposition, and packaging.
In addition, attendees will learn how the COMSOL Multiphysics® software is used to optimize semiconductor manufacturing processes and packaging, as well as enhance the quality and efficiency of their simulation tasks.
Schedule
Modeling and simulation is essential for the successful development of semiconductor devices, from front-end processes to advanced packaging. The COMSOL Multiphysics® software and its add-on products are widely used in the design of processes such as etching, doping, and deposition.
The software’s unique multiphysics capabilities enable accurate modeling of chemical vapor deposition, inductively coupled plasma (ICP) reactors, ion implantation, rapid thermal annealing, as well as wet chemical processes like electrodeposition and electrochemical etching. COMSOL Multiphysics® is also extensively used for packaging design, where models involve thermal management, nonlinear stress analysis, and electromigration.
Join us in this session for an overview of how COMSOL Multiphysics® is used in the modeling and simulation of semiconductor processes and packaging.
John Neumann, KLA (SPTS Etch Release Division)
Semiconductor tool design and processes usually involve chemical and physical processes that are complex and have enough unknowns that a fully predictive simulation may not be attempted. Instead, back-of-the-envelope calculations, spreadsheets, or similar are often used, especially for engineers with limited simulation experience. However, even “incomplete” simulations (ones in which not all parameters are known) can be useful for understanding processes and designing experiments. In this keynote talk, John Neumann will discuss how the COMSOL Multiphysics® software can make setting up and running a simulation fast and painless enough so that more casual and frequent simulations are likely to be done. KLA encourages simulation as well by investing in software and training.
Plasma reactors are critical for surface-reaction processes in the fabrication of semiconductor devices. To understand and design plasma reactors, and predict their behavior, modeling and simulation plays an important role.
The Plasma Module, an add-on product to COMSOL Multiphysics®, provides a diverse set of features for modeling various types of reactors, including inductively coupled plasma (ICP), capacitively coupled plasma (CCP), ICP/CCP, DC, and microwave-excited reactors. These features enable the modeling of fluid mechanics, chemical reactions, physical kinetics, heat transfer, mass transfer, and electromagnetics in 1D, 2D, and 3D for both time-dependent and stationary models.
Join us in this session to learn about the unique capabilities of the Plasma Module and see how they can be applied to plasma reactor modeling.
Advanced packaging engineers are faced with demands for miniaturization, higher power densities, and improved mechanical and thermal robustness. Addressing these challenges requires a comprehensive understanding of the multiphysics interactions within semiconductor packages, including those involving electromagnetics, heat transfer, structural mechanics, and fluid dynamics.
In this session, we will demonstrate how multiphysics simulation enables engineers to analyze and optimize advanced packaging designs under realistic operating conditions. Using the COMSOL Multiphysics® software, we will showcase models covering thermal dissipation strategies, stress analysis, electromigration risks, and signal integrity.
Join us to learn how simulation-driven design improves efficiency and reliability, accelerating innovation in advanced packaging.
Vacuum technology plays an important role in the fabrication of semiconductor and MEMS devices. Modeling and simulation is used to understand and design vacuum systems. However, traditional CFD methods based on Navier–Stokes equations are inadequate for modeling the ultrahigh vacuum gas environment inside of a fabrication chamber.
This issue can be addressed with the Molecular Flow Module, which is specifically designed for modeling highly rarefied gas flows. It also has the unique capability to couple rarefied flow with other physical phenomena, such as temperature and electromagnetic fields.
Join us in this session to get an overview of the functionality in the Molecular Flow Module and learn about how it can be used to design vacuum systems.
The processes commonly used in semiconductor manufacturing involve various chemical processes, including chemical vapor deposition, plasma-enhanced chemical vapor deposition, etching in plasma reactors, wet-chemical etching, doping, and electrodeposition. To gain insight into such surface processes and optimize them, many researchers and engineers use COMSOL Multiphysics®.
The Plasma Module, an add-on product to COMSOL Multiphysics®, offers advanced features for modeling electron implant reactions, heavy species reactions, and surface reactions, including the growth of deposited layers. Meanwhile, the Chemical Reaction Engineering Module provides comprehensive descriptions of surface reactions like deposition, adsorption, and desorption. COMSOL Multiphysics®, and its add-on products, offers unique capabilities that allow for the integration of chemical reactions with other physical phenomena, such as fluid flow, heat transfer, and electromagnetic fields, which can have an impact on both bulk and surface chemical reactions.
Join us in this session to learn more about the COMSOL Multiphysics® functionality for modeling chemical vapor deposition, etching, and related processes in semiconductor processing. We will give an overview of relevant products, such as the Plasma Module, the Chemical Reaction Engineering Module, and the Electrodeposition Module.
Register for COMSOL Day: Semiconductor Processing & Packaging
To register for the event, please create a new account or log into your existing account. You will need a COMSOL Access account to attend COMSOL Day: Semiconductor Processing & Packaging.
For registration questions or more information contact info@comsol.com.
COMSOL Day Details
May 29, 2025 | 11:00 a.m. EDT (UTC-04:00)