Coupling Piezoelectric, Thermal, and Structural Analyses in COMSOL®
Durée: 58:18
Watch this archived webinar, originally hosted by IEEE Spectrum, to learn how to couple piezoelectricity, structural vibration, and heat transfer with the COMSOL Multiphysics® software.
Kyle Koppenhoefer of AltaSim Technologies demonstrates how to perform a fully coupled piezoelectric, structural vibration, and thermal analysis of a structure. He also discusses the simulation results used for predicting temperature distribution in the structure and how heating affects its resonance frequency.
Tip: Browse for upcoming live webinars here.
Chapter Selection
Introduction (0:00)
Poll Question (3:29)
Piezoelectric-Thermal-Structural Modeling with COMSOL Multiphysics® (5:08)
Complex Multiphysics Coupling for Heating of Vibrating Structure (7:05)
Piezoelectric Devices Used in a Wide Range of Applications (8:40)
Overview of Piezoelectric materials (9:21)
Piezoelectric Effect Works in Two Directions (9:35)
Constitutive Equations are Coupled for Piezoelectric Materials (10:26)
Poling Direction is a Critical for Piezoelectric Material Properties (11:35)
Boundary Conditions are Multiphysics (12:26)
Structural Mechanics / Vibrational Heating (12:46)
Temperature Changes Produce Displacement/Stress (13:23)
Dimensional Changes Effect Natural Frequencies of Structure (13:43)
Demonstration of Piezoelectric Modeling (14:08)
Live Demonstration (17:43)
AltaSim Technologies (33:39)
COMSOL Multiphysics® (35:18)
Piezoelectric Devices Modeling (37:00)
Piezoelectric Materials in COMSOL Multiphysics® (39:18)
Piezoelectric Device Modeling Examples (39:55)
Piezoelectric Devices Results (41:07)
Q&A (42:16)