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Voyez comment la modélisation et la simulation sont utilisées par les industries La modélisation et la simulation multiphysiques pilotent l'innovation dans tous les grands secteurs d'activité et dans le monde universitaire — comme en témoignent les nombreuses utilisations présentées dans des articles et des posters techniques présentés par des ingénieurs, chercheurs et scientifiques à la Conférence COMSOL chaque année. Inspirez-vous des récents proceedings réunis ci-dessous, ou, pour trouver les présentations les plus intéressantes dans votre domaine d'intérêt, utilisez la recherche rapide.

Consultez les proceedings de la Conference COMSOL 2024

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Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... En savoir plus

Modelling of Micro/Macro Densification Phenomena of Cu Powder during Capacitor Discharge Sintering

G. Maizza[1] and A. Tassinari[1]

[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... En savoir plus

Modelling of SiC Chemical Vapour Infiltration Process Assisted by Microwave Heating

G. Maizza[1] and M. Longhin[1]
[1]Dipartimento di Scienza dei Materiali ed Ingegneria Chimica, Politecnico di Torino, Torino, Italy

The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... En savoir plus

Numerical Simulation of Pulsed TIG Welding Partial and Full Penetration

A. Traidia[1][2], F. Roger[1], and E. Guyot[2]

[1]Ecole Nationale Supérieure de Techniques Avancées, Palaiseau, France
[2]AREVA NP, Centre Technique Soudage, France

In this poster, a numerical model of spot pulsed current TIG welding for partially and fully penetrated weld pools is presented. Heat transfer and fluid flow in the weld pool driven by the combination of electromagnetic force, buoyancy force, surface tension gradient and latent heat are ... En savoir plus

Two-dimensional Analysis of Triple Coupled Physics of Structural Mechanics, Diffusion and Heat Transfer in a Gas Pipe

P. Lee-Sullivan[1], and M. Haghighi-Yazdi[1]
[1]Department of Mechanical and Mechatronics Engineering, University of Waterloo, Waterloo, Ontario, Canada

In this study, a 2-D model has been built using COMSOL Multiphysics® to analyze a triple coupled physics problem involving simultaneous gas diffusion, heat transfer, and structural mechanics in a pipe due to the flow of high-pressure carbon dioxide. The problem geometry and boundary ... En savoir plus

Optimization of Carbon Nanotube Field Emission Arrays

B. L. Crossley[1], M. Kossler[1], P.J. Collins[1], R. A. Coutu Jr.[1], and L. A. Starman[1]

[1]Air Force Institute of Technology, Wright-Patterson AFB, Ohio, USA

Carbon nanotubes (CNTs) have been proven experimentally to be well suited for field emission applications. An optimized triode configured CNT field emission array is developed using the COMSOL Multiphysics Electrostatics Application to adjust five key physical dimensions to investigate ... En savoir plus

Coupled Structural and Magnetic Models: Linear Magnetostriction in COMSOL

J. Slaughter[1]
[1]Etrema Products, Inc., Ames, Iowa, USA

Accurate modeling of magnetostrictive materials and devices requires coupling of electrical, magnetic, mechanical, and possibly acoustic domains. There are relatively few finite element software packages that include all these physical models and even fewer that include magnetostrictive ... En savoir plus

Nanoscale Heat Transfer using Phonon Boltzmann Transport Equation

S. Sihn[1,2], and A.K. Roy[2]

[1]Air Force Research Laboratory, Wright-Patterson Air Force Base, Dayton, Ohio, USA
[2]University of Dayton Research Institute, Dayton, Ohio, USA

COMSOL Multiphysics was used to solve a phonon Boltzmann transport equation (BTE) for nanoscale heat transport problems. One dimensional steady-state and transient BTE problems were successfully solved based on finite element and discrete ordinate methods for spatial and angular ... En savoir plus

COMSOL in a New Tensorial Formulation of Non-Isothermal Poroelasticity

A. Mario-Cesar Suarez[1], and V. Fernando Samaniego[2]

[1]Faculty of Sciences, Michoacan University, Morelia, Mich., Mexico
[2]Faculty of Engineering, National University of Mexico, Mexico City, Mexico

The presence of a moving fluid in a porous rock modifies its mechanical response. Poroelasticity explains how the fluid inside the pores bears a portion of the total load supported by the rock. The remaining part of the load is supported by the elastic skeleton, which contains a laminar ... En savoir plus

Benchmarking COMSOL - Part 2: CFD Problems

Darrell Pepper
Professor of Mechanical Engineering,
University of Nevada - Las Vegas

Using COMSOL 3.5a, a set of benchmark problems requiring the use of the COMSOL Computational Fluid Dynamics (CFD) module has been simulated. Several of the problems include fluid-heat transfer interactions (Computational Heat Transfer - CHT). The four problems are: flow over a 2-D ... En savoir plus

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