Simulation of Electro-Thermal Behavior of an Overlap Solder Interconnection
Solder connections are one of the most essential parts of the PCBs. Despite many well-known scientific works that have been done about overlap solder interconnection properties, such as fracture, fatigue and reliability studies, little attention have been given to the investigation of the connection between effects of electrical properties and laboratory soldering shortages such as effects of solder defects on computer simulation.
In this project, with considering many aspects, effects and constituents of a specific solder alloy, to create a suitable computer model of solder joints. In order to get closer to the real result (to simulate the real behavior of the model) the actual solder joint is manufactured and analyzed in the laboratory with two different technologies of soldering (reflow oven and solder pot); besides the results are then compared with our simulation models and the computer simulation is considered and implemented based on the scientific works (intermetallic compounds) and the empirical vision (inner deformation and temperature effects).
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