Articles techniques et présentations

Micro heat sinks can be widely used for cooling in modern microelectronic high heat flux components where the amount of heat generated sometimes exceeds the limit which the system can withstand. Microstructures when introduced into the channels of heat sinks in form of micro fins enhance the heat transfer performance of the heat sinks further. Copper heat sinks with different types of micro fins in the channel are analyzed for their heat transfer performance in this paper using convective heat flux feature of Heat Transfer Module of COMSOL Multiphysics software. In this study the heat sinks with square, circular and elliptical fins on the channel base are compared with heat sink without fins for their heat transfer performance and corresponding pressure drops.