La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This non-conventional model of porous media flow utilizes creeping (Stokes) flow in the interstices of a porous media. The model comes from the pore-scale flow experiments conducted by Arturo Keller, Maria Auset, and Sanya Sirivithayapakorn of the University of California, Santa Barbara. ... En savoir plus
Fatigue testing of nonlinear materials with creep mechanism is a time-consuming process. In accelerated life testing the experiment time is greatly reduced by subjecting the material to testing conditions in excess of the operating one. In the model an aggressive thermal load cycle is ... En savoir plus
This example illustrates the principle of electrochemical polishing. The simplified 2D model geometry consists of two electrodes and an intermediate electrolyte domain The positive electrode has a protrusion, representing a surface defect. The purpose of the model is to examine how this ... En savoir plus
In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon ... En savoir plus
This model shows how to model the avalanche breakdown due to the impact ionization in a Silicon Carbide diode. The current-voltage (I-V) characteristics of the device are presented as well as the electric field distribution plot. Furthermore, the carrier generation term has been computed ... En savoir plus
In modeling of transport by diffusion or conduction in thin layers, we often encounter large differences in dimensions of the different domains in a model. If the modeled structure is a so-called sandwich structure, we can replace the thinnest geometrical layers with a thin layer ... En savoir plus
Inductive devices experience capacitative coupling between conductors at high frequencies. Modeling this phenomenon requires that you describe electric fields that have components both parallel with and perpendicular to the wire. This consideration might lead to the conclusion that a 3D ... En savoir plus
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... En savoir plus
This model sets up a linear array of nine tonpilz piezoelectric transducers in a 3x3 grid. A voltage is applied that includes a phase change across the three rows. The transducers are located in a box below the sea surface. The exterior acoustics are modeled using the Pressure ... En savoir plus
The model demonstrates the basics of the 3-omega method. The coupled electromagnetic heating problem is solved in a solid sample which is heated by a thin copper strip, deposited on the surface of a sample. Analyzing the frequency dependence of the voltage oscillation amplitude, we ... En savoir plus