La Bibliothèque d'Applications présente des modèles construits avec COMSOL Multiphysics pour la simulation d'une grande variété d'applications, dans les domaines de l'électromagnétisme, de la mécanique des solides, de la mécanique des fluides et de la chimie. Vous pouvez télécharger ces modèles résolus avec leur documentation détaillée, comprenant les instructions de construction pas-à-pas, et vous en servir comme point de départ de votre travail de simulation. Utilisez l'outil de recherche rapide pour trouver les modèles et applications correspondant à votre domaine d'intérêt. Notez que de nombreux exemples présentés ici sont également accessibles via la Bibliothèques d'Applications intégrée au logiciel COMSOL Multiphysics® et disponible à partir du menu Fichier.
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... En savoir plus
Recent advances in the fabrication of microfluidic systems require handling of live cells and other micro particles as well as mixing. All this can, for example, be achieved using acoustic radiation forces and the viscous drag from the streaming flow. Streaming: Due to the nonlinear ... En savoir plus
This example shows how to compute deformations caused by secondary creep in a turbine stator blade. The creep rate is highly influenced by temperature, and the deformation and stress relaxation is thus controlled by the temperature field. En savoir plus
Carbon deposition on the surface of solid catalysts is commonly observed in hydrocarbon processing. A known problem is that carbon deposits can impede the activity of catalysts as well as block the flow of gas through a catalyst bed. This example investigates the thermal decomposition ... En savoir plus
In a cooling system, a microelectronic component has been identified as the critical link. Since the power is repeatedly switched on and off, the component is subjected to thermal cycling. As a results a crack grows through a solder joint and disconnects the chip from the printed circuit ... En savoir plus
This tutorial models how the relative humidity of the inlet gases impacts the performance of a low-temperature polymer electrolyte membrane-electrode assembly. The model includes humidity-dependent ionomer (electrolyte) conductivities, gas phase mass transport and water ionomer ... En savoir plus
This example demonstrates how to use temperature dependent materials within the Nonlinear Structural Materials Module. A large container holds pressurized hot water. Several pipes are attached to the pressure vessel. Those pipes can rapidly transfer cold water in case of an emergency ... En savoir plus
This tutorial demonstrates the use of the Heat and Moisture Flow predefined interface for the modeling of heat transfer and moisture transport in a turbulent air flow, with the quantification of evaporation and condensation on surfaces, and the automatic handling of the associated latent ... En savoir plus
This example is about the modeling of the fiber drawing process. Thermal fiber drawing is a process in which a comparatively thicker structure is heated and drawn into extended lengths of microstructured fiber. This process is done by passing them through the furnace and pulling them ... En savoir plus
This tutorial shows how to use the Radiative Beam in Absorbing Media interface (Heat Transfer Module) to model the attenuation of a laser light going through a sample of silica glass, and the heat source generated by the absorption. En savoir plus