Discussion Closed This discussion was created more than 6 months ago and has been closed. To start a new discussion with a link back to this one, click here.
Structural mechanics & thermal conduction: How to put an stressfree layer on a stressed assembly?
Posted 27 sept. 2010, 06:37 UTC−4 2 Replies
Please login with a confirmed email address before reporting spam
Hi
I want to put a layer with zero stress on a stressed assembly. This is something that occurs often in manufacturing.
Let's assume a mechanical assembly with some internal stress causing mechanical deformation of the assembly (e.g. caused by different thermal expansion of the assembly materials)? How can you SUBSEQUENTLY put a stressfree layer on top of the stressed assembly?
Many thanks
I want to put a layer with zero stress on a stressed assembly. This is something that occurs often in manufacturing.
Let's assume a mechanical assembly with some internal stress causing mechanical deformation of the assembly (e.g. caused by different thermal expansion of the assembly materials)? How can you SUBSEQUENTLY put a stressfree layer on top of the stressed assembly?
Many thanks
2 Replies Last Post 28 sept. 2010, 07:46 UTC−4
Please login with a confirmed email address before reporting spam
Posted:
1 decade ago
Hi
I see two ways, but it depends im my view of how the stress is present wehn "assembling" the parts so that the model represents truely the "real case"
One is to set the initial stress values for one of the two domains, but this means to set the true stress tensor values, this is not trivial, but could be obtained from a stationary analysis, and then partly changed/adapted manually.
The second is to change a parameter per domain, i.e. two plates with each a different temperature T (full thermal isolation between them, no conduction steady state T). I would say this is the "old" engineering way, as the structural strengths of both material participate then to have a contium at the interface. On can also set different temperature profiles on the different materials.
If you issue is a true temperature stress induced case, then you use normal thermal conduction and contact resistance, but you play with the time variation of the temperature, I believe there is soemwhere an example of a thermal stress fit axis
hope this helps
--
Good luck
Ivar
I see two ways, but it depends im my view of how the stress is present wehn "assembling" the parts so that the model represents truely the "real case"
One is to set the initial stress values for one of the two domains, but this means to set the true stress tensor values, this is not trivial, but could be obtained from a stationary analysis, and then partly changed/adapted manually.
The second is to change a parameter per domain, i.e. two plates with each a different temperature T (full thermal isolation between them, no conduction steady state T). I would say this is the "old" engineering way, as the structural strengths of both material participate then to have a contium at the interface. On can also set different temperature profiles on the different materials.
If you issue is a true temperature stress induced case, then you use normal thermal conduction and contact resistance, but you play with the time variation of the temperature, I believe there is soemwhere an example of a thermal stress fit axis
hope this helps
--
Good luck
Ivar
Please login with a confirmed email address before reporting spam
Posted:
1 decade ago
Hi
have you checked the layered_plate thermal library model, does this look like your case ?
--
Good luck
Ivar
have you checked the layered_plate thermal library model, does this look like your case ?
--
Good luck
Ivar